Company Name: KOBAY TECHNOLOGY BERHAD
Stock Name: KOBAY
Date Announced: 16 Nov 2021
Category: General Announcement for PLC
Reference Number: GA1-16112021-00028
Type: Announcement
Subject: NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description: KOBAY TECHNOLOGY BHD (“KOBAY” OR THE “COMPANY”)
PRIVATE PLACEMENT OF UP TO 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF KOBAY (EXCLUDING TREASURY SHARES) (“PRIVATE PLACEMENT”)
We refer to the Company’s announcements dated 5 November 2021, 8 November 2021 and 11 November 2021 in relation to the Private Placement. Unless otherwise stated, the terms used herein shall have the same meaning as defined in the said announcements.
On behalf of the Board, RHB Investment Bank Berhad wishes to announce that the issue price for the first tranche of the Private Placement (“First Tranche”) has been fixed on 16 November 2021 at RM5.55 per Placement Share and will comprise up to 20,000,000 Placement Shares.
The issue price of RM5.55 per Placement Share represents a discount of approximately 2.50% to the 5-day VWAMP of Kobay Shares up to and including 15 November 2021, being the last market day immediately preceding the price-fixing date, of RM5.6923 per Kobay Share.
For information purpose, the actual number of Placement Shares to be placed out under the First Tranche will depend on the final acceptance by the identified placees. Any Placement Share not placed out under the First Tranche will be included in the subsequent tranches. The issue price for each subsequent tranche will be determined and announced by the Board separately.
This announcement is dated 16 November 2021.