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SAWIN300
provides
cost-effective solution with value for money sawing machine
that designed and assembled in
Malaysia
. The
compact design enabled the machine suitable in wafer, BGA
Strip, ceramic, glass etc. application. The machine is
equipped with user-friendly software with setting in either
imperial or metric unit measure in extend of mil and micron.
The state-of-the-art compact and short design of the high
speed aero-static spindle with variable speed control up to
60k RPM provides speedy and precise sawing or dicing in most
applications.
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